UNPARALLELED PERFORMANCE With the fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and latest technologies. GIGABYTE motherboards are equipped with upgraded power solution, latest storage standards and outstanding connectivity to enable optimized performance for gaming. Direct Digital VRM Design To ensure maximum Turbo Boost and overclocking performance of Intel's new generation CPU, GIGABYTE AORUS series motherboard equip the best VRM design ever built with the highest quality components. PCIe 5.0 Design Design Ready for PCIe 5.0 PCIe 5.0 Design supports double the bandwidth of PCIe 4.0 and ensures that compatible with cutting-edge SSDs and GPUs released in the next few years to their full capability. Ultra Durable™ SMD PCIe 5.0 x4 M.2 Connector The first PCIe 5.0 x4 M.2 Slot supports the latest M.2 25110 form factor. Reinforced PCIe 5.0 M.2 connectors with metal shielding to provide higher strength. The New Generation Ultra Durable™ SMD PCIe 5.0 Armor The new generation, GIGABYTE's exclusive stainless-steel PCI-e shielding becomes 20% wider providing reinforced tensile strength. Unlock DDR5 DDR5 Overclocking Up to 7950 and Beyond* AORUS is offering a tested and proven platform that has memory overclocking capability up to 7950 and beyond. For DDR5 XMP Memory, all users need to do to attain high memory performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard. Shielded Memory Routing All memory routing is under the PCB inner layer shielded by a large ground layer to protect from external interference. Impedance Optimized Topology By optimizing memory trace width, length and style from HPC simulation to actual implementation, overall impedance is lowered between CPU memory controller and memory modules to achieve higher DDR5 speed. Low Signal Loss PCB Server grade mid-loss or low-loss PCB material is chosen to lower signal loss inside PCB and maintain DDR5 high speed signal transmission. DDR5 Auto Booster Automatically Boost the Native DDR5 frequency to 5000MHz while the system is under heavy loading by a single click. DDR5 Memory Upgrade GIGABYTE BIOS offers pre-defined and retrievable profiles for users to get higher performance easily. The profiles are based on a database that is created by checking each memory IC and PMIC vendors to optimize the modules to unleash their full potential. This is a time saving feature to manually configure overclocked DDR5 memory kits.  XMP 3.0 User Profile Define and create your own SPD profile into Native and XMP 3.0 memory modules or apply the pre-tuned profiles to XMP 3.0 User Profile. Two user-defined profiles can be saved, loaded either locally or from/to an external storage device. Two empty SPD profiles can be defined by users and carry to next computer Transfer DDR5 XMP Booster profiles into XMP 3.0 User Profiles Quick memory performance simulation based on user input clock and timing parameters Profile save and load function to share your memory parameters online Hybrid Cores Optimization With new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy. OUTSTANDING THERMAL DESIGN GIGABYTE Motherboards' unparalleled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance. Fins-Array III GIGABYTE new generation Fins-Array III delivers the ultimate thermal performance by using Extended Irregular fins to fill all available space and vastly increases surface area. A piece of Fins-Array III heatsink surface area is larger than 2 full size ATX motherboard PCB, therefore it tremendously boost thermal efficiency and heat exchange performance. Nanocarbon Coated Fin Array Heatsink As CPUs get more powerful, VRM modules get hotter under ultra high performance. Being the first adopters among industry using NanoCarbon as coating material to enhance thermal radiation speed up heat dissipation. Nanocarbon is coated onto the heatsink through electrostatic adhesion. The coating material covers the entire finned heatsink with 200μm in thickness. In that way, heat is dissipated more quickly. The tests show 10% cooler with the NanoCarbon coating. M.2 Thermal Guard III M.2 Thermal Guard III constructed with 9X optimized heat dissipation surface to prevent throttling and bottleneck that high-speed/ large capacity of PCIe 5.0 M.2 SSDs may cause, especially under heavy workload.The special design of heatsink grooves in the direction of CPU further enhances the in-chassis air flow and optimizes the heat convection efficiency. Smart Fan 6 Smart Fan 6 contains several unique coo